IT-180GNBS
IT-180GNBS
IT-180GNBS no/low flow prepreg is a halogen free High Tg (175℃ by DSC) multifunctional epoxy. It’s designed for rigid flex board and heat sink bonding application.
Application
Rigid Flex Board
Key Features
Halogen-Free, Phosphorous-containing Epoxy Prepreg
Superior bonding strength to bonding sheet prepreg
Low powder for punching processing
Minimal and uniform flow performance
Good thickness uniformity and flatness
Property
|
Items |
Methods |
IT-180GNBS |
|
Tg (℃) |
DSC |
175 |
|
T-288 (w/ 1oz Cu, min) |
TMA |
>30 |
|
Td-5%(℃ ) |
TGA 5% loss |
365 |
|
CTE (ppm/℃) |
a1/a2 |
50/275 |
|
CTE (%), 50-260℃ |
TMA |
2.9 |
|
Dk @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
4.0 |
|
Df @ 10 GHz (RC 50%) |
IPC TM-650 2.5.5.13 |
0.016 |